The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2013
Filed:
Aug. 12, 2011
Qwai H. Low, Cupertino, CA (US);
Chok J. Chia, Cupertino, CA (US);
Kishor Desai, Fremont, CA (US);
Charles G. Woychik, San Jose, CA (US);
Huailiang Wei, Allen, TX (US);
Qwai H. Low, Cupertino, CA (US);
Chok J. Chia, Cupertino, CA (US);
Kishor Desai, Fremont, CA (US);
Charles G. Woychik, San Jose, CA (US);
Huailiang Wei, Allen, TX (US);
Tessera, Inc., San Jose, CA (US);
Abstract
A microelectronic assembly can include a microelectronic element and a lead frame having a first unit and a second unit overlying the first unit and assembled therewith. The first unit can have a first metal layer comprising a portion of the thickness of the lead frame and including terminals and first conductive elements extending away therefrom. The second unit can have a second metal layer comprising a portion of the thickness of the lead frame and including bond pads and second conductive elements extending away therefrom. The first and second units each can have an encapsulation supporting at least portions of the respective first and second conductive elements. At least some of the second conductive elements can overlie portions of corresponding ones of the first conductive elements and can be joined thereto. The microelectronic element can have contacts electrically connected with the bond pads of the lead frame.