Cupertino, CA, United States of America

Qwai Hoong Low

This inventor holds 48 USPTO granted patents and 1 published patent application and 1 EPO patent, primarily in 3D Interconnect Technology. Top assignees: Lsi Logic Corporation, Lsi Corporation, Adeia Semiconductor Bonding Technologies Inc.. Active years: 1994-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Qwai Hoong Low. Retrieved from https://idiyas.com/inventor/qwai-hoong-low

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 48 

% Patents Active = 87.5

 

Average Co-Inventor Count = 3.1

ph-index = 11

Forward Citations = 715(Granted Patents)


Company Filing History:


Years Active: 1994-2024

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Areas of Expertise:
3D Interconnect
Electronic Device Packaging
Heat Dissipation
Low Cost Hybrid Package
Flip-Chip QFN
Thermal Management
Wire Bonding
Integrated Circuit Package
Dielectric Stack
Ball Grid Array
Molded Tape
Test Structure
48 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Qwai Hoong Low - Pioneering 3D Interconnect Technology

Introduction:

Qwai Hoong Low, a visionary inventor based in Cupertino, CA, is renowned for his groundbreaking work in the field of microelectronics. With an impressive portfolio of 47 patents, Low has consistently pushed the boundaries of innovation in the industry. His latest patents on 3D-interconnect technology demonstrate his relentless pursuit of excellence in the field.

Latest Patents:

Low's recent patents revolve around a revolutionary method of making microelectronic packages. His innovative approach involves bonding a conductive structure to a carrier, creating a high-performance system for microelectronic assembly. By encapsulating the interconnections and microelectronic elements, Low ensures optimal functionality and reliability in his designs.

Career Highlights:

Having worked at esteemed companies like LSI Logic Corporation and LSI Corporation, Low has honed his skills and expertise in the microelectronics domain. His hands-on experience in developing cutting-edge technologies has cemented his reputation as a trailblazer in the industry. Low's dedication to innovation is evident in the quality and impact of his patented inventions.

Collaborations:

Throughout his career, Low has collaborated with exceptional professionals in the field. Noteworthy coworkers such as Chok J Chia and Ramaswamy Ranganathan have contributed to the success of his projects. Together, they have shared insights, expertise, and a passion for advancing microelectronics, leading to the development of groundbreaking solutions.

Conclusion:

In conclusion, Qwai Hoong Low stands out as a pioneering figure in the world of microelectronics, with a proven track record of innovation and excellence. His relentless pursuit of pushing the boundaries of technology through his patented inventions showcases his unwavering commitment to advancing the field. Low's contributions have not only transformed the industry but have also inspired a new generation of inventors to strive for innovation and excellence.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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