The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2013
Filed:
Sep. 09, 2008
Applicants:
Qwai H. Low, Cupertino, CA (US);
Chengyu Guo, Saratoga, CA (US);
Inventors:
Qwai H. Low, Cupertino, CA (US);
Chengyu Guo, Saratoga, CA (US);
Assignee:
LSI Corporation, Milpitas, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01);
U.S. Cl.
CPC ...
Abstract
A wire bond design integrated circuit with a substrate having a front side and an opposing back side. Circuitry is disposed on the font side. Electrically conductive vias are disposed through the substrate from the front side to the back side, and are electrically connected to the circuitry such that the electrically conductive vias provide power and ground services only for the circuitry. Bonding pads are disposed on the front side, and are electrically connected to the circuitry such that the bonding pads provide signal communication only for the circuitry.