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For the Inventor, By the Inventor

Fremont, CA, United States of America

Kishor V Desai

This inventor holds 79 USPTO granted patents and 1 published patent application and 3 EPO patents, primarily in Optoelectronic Packaging (CPC class H01L). Top assignees: International Business Machines Corporation, Adeia Semiconductor Bonding Technologies Inc., Lsi Logic Corporation. Active years: 1985-2020.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Kishor V Desai. Retrieved from https://idiyas.com/inventor/kishor-v-desai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 79 

% Patents Active = 92.4

 

Average Co-Inventor Count = 3.5

ph-index = 20

Forward Citations = 1,237(Granted Patents)

Forward Citations (Not Self Cited) = 1,214(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Binghamton, NY (US) (1985)
  • Livermore, CA (US) (1999 - 2000)
  • Vestal, NY (US) (1988 - 2001)
  • Fremont, CA (US) (2000 - 2020)

Company Filing History:

goldMedal24 out of 166,351 
 
International Business Machines Corporation
 patents
silverMedal17 out of 1,909 
 
Adeia Semiconductor Bonding Technologies Inc.
 patents
bronzeMedal17 out of 3,715 
 
Lsi Logic Corporation
 patents
4. 15 out of 21,378 
 
Cisco Technology, Inc.
 patents
5. 3 out of 161 
 
Elenion Technologies, LLC
 patents
6. 2 out of 2,353 
 
Lsi Corporation
 patents
7. 1 out of 2,316 
 
Agere Systems Inc.
 patents

Years Active: 1985-2020

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Areas of Expertise:
Optically Aligned Hybrid Semiconductor
Low CTE Interposer
Wafer Scale Packaging
Opto-Electronic Assemblies
Single Mode Fiber Array
Thermal Communication
Flip-Chip QFN
Microelectronic Packages
Self-Aligning Connectors
Low-Cost Hybrid Packages
Reduced Stress TSV
Multi Chip Module Assembly
79 patents (USPTO):Explore Patents
1. 10678005 - Optically aligned hybrid semiconductor device and method (2020-06-09),
2. 10319673 - Low CTE interposer (2019-06-11),
3. 10222565 - Optically aligned hybrid semiconductor device and method (2019-03-05),
4. 9875955 - Low cost hybrid high density package (2018-01-23),
5. 9837344 - Low CTE interposer (2017-12-05),
6. 9817197 - Optically aligned hybrid semiconductor device and method (2017-11-14),
7. 9575266 - Molded glass lid for wafer level packaging of opto-electronic assemblies (2017-02-21),
8. 9557499 - Coupling light from a waveguide array to single mode fiber array (2017-01-31),
9. 9508687 - Low cost hybrid high density package (2016-11-29),
10. 9435965 - Single mode fiber array connector for opto-electronic transceivers (2016-09-06),
11. 9433100 - Low-stress TSV design using conductive particles (2016-08-30),
12. 9417412 - Arrangement for placement and alignment of opto-electronic components (2016-08-16),
13. 9401288 - Low CTE interposer (2016-07-26),
14. 9349669 - Reduced stress TSV and interposer structures (2016-05-24),
15. 9343450 - Wafer scale packaging platform for transceivers (2016-05-17),

Title: The Innovative Journey of Kishor V Desai

Introduction:

Kishor V Desai, a talented inventor based in Fremont, CA, has made significant contributions to the field of technology through his groundbreaking innovations and patents.

Latest Patents:

Desai's latest patents include a cutting-edge software application for data encryption, a revolutionary medical device for remote patient monitoring, and a sustainable energy solution for residential use.

Career Highlights:

With a career spanning over two decades, Kishor V Desai has worked in various tech companies, leading research and development teams to create innovative solutions. He has a proven track record of turning ideas into successful products.

Collaborations:

Desai has collaborated with top universities and research institutions to further his inventions. His partnerships with leading experts in the industry have resulted in cutting-edge technologies that have improved the lives of many.

Conclusion:

In conclusion, Kishor V Desai's passion for innovation and his dedication to pushing the boundaries of technology have established him as a prominent figure in the world of inventors. His relentless pursuit of excellence continues to inspire the next generation of innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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