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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chih-Jen Wu

USPTO Granted Patents = 18

Average Co-Inventor Count = 5.0

ph-index = 4

Forward Citations = 92(Granted Patents)


Location History:

  • Hsin-chu County, TW (2014)
  • Hsin-Chu, TW (2012 - 2016)
  • Chu-Dong Town, Hsin-chu County, TW (2016)
  • Chu-Dong Town, TW (2013 - 2022)

Company Filing History:

goldMedal18 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2012-2022

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18 patents (USPTO):
1. 11358252 - Method of using a polishing system (2022-06-14),
2. 10357867 - Polishing system (2019-07-23),
3. 9718164 - Polishing system and polishing method (2017-08-01),
4. 9377503 - Semiconductor test structures (2016-06-28),
5. 9330901 - Nitrogen-containing oxide film and method of forming the same (2016-05-03),
6. 9257326 - Method of making backside illuminated image sensors (2016-02-09),
7. 9250286 - Semiconductor test structures (2016-02-02),
8. 8952474 - Method of fabricating backside-illuminated image sensor (2015-02-10),
9. 8946847 - Backside illuminated image sensors and method of making the same (2015-02-03),
10. 8796105 - Method and apparatus for preparing polysilazane on a semiconductor wafer (2014-08-05),
11. 8791541 - Backside-illuminated image sensor having a supporting substrate (2014-07-29),
12. 8704224 - Semiconductor test structures (2014-04-22),
13. 8674469 - Isolation structure for backside illuminated image sensor (2014-03-18),
14. 8605276 - Enhanced defect scanning (2013-12-10),
15. 8586404 - Method for reducing contact resistance of CMOS image sensor (2013-11-19),

Title: Innovations in Polishing Systems: The Contributions of Inventor Chih-Jen Wu

Introduction

Chih-Jen Wu, an acclaimed inventor based in Hsinchu, Taiwan, has significantly contributed to the field of semiconductor manufacturing. With a remarkable portfolio of 18 patents, his innovations have paved the way for advancements in polishing systems critical for wafer processing.

Latest Patents

Among his latest inventions, Wu has developed novel methods for using a polishing system that enhances the quality and efficiency of wafer processing. One notable patent describes a method that involves securing a wafer to a support, polishing it with a rotating first polishing pad that has a diameter greater than the wafer, and subsequently rotating the support to polish a second region with a second polishing pad that is smaller than the wafer diameter. This systematic approach optimizes the polishing process while ensuring precision in the semiconductor fabrication.

Career Highlights

Chih-Jen Wu's career is marked by his work at Taiwan Semiconductor Manufacturing Company Limited, a leader in the semiconductor industry. His expertise in developing polishing systems has made substantial contributions to the efficiency and effectiveness of manufacturing processes within the company. With a total of 18 patents to his name, his work continuously influences the field and enhances production capabilities.

Collaborations

Wu has collaborated with esteemed colleagues such as Chen-Ming Huang and An-Chun Tu, both of whom are recognized for their contributions in the semiconductor industry. These partnerships have been instrumental in driving innovation and pushing the boundaries of technology in wafer processing.

Conclusion

Chih-Jen Wu exemplifies the spirit of innovation within the semiconductor manufacturing industry. His dedication to advancing polishing systems not only showcases his ability as an inventor but also reflects the collaborative effort that characterizes successful technological advancements. As the demand for precision in semiconductor fabrication continues to grow, Wu's contributions will undoubtedly remain influential in shaping the future of the industry.

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