The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 23, 2019
Filed:
Jul. 18, 2017
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Shih-Chi Lin, Hsinchu, TW;
Kun-Tai Wu, Hsinchu, TW;
You-Hua Chou, Hsinchu, TW;
Chih-Tsung Lee, Hsinchu, TW;
Min Hao Hong, Kaohsiung, TW;
Chih-Jen Wu, Chu-Dong Town, TW;
Chen-Ming Huang, Hsinchu, TW;
Soon-Kang Huang, Hsinchu, TW;
Chin-Hsiang Chang, New Taipei, TW;
Chih-Yuan Yang, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A polishing system includes a wafer support that holds a wafer, the wafer having a first diameter. The polishing system further includes a first polishing pad that polishes a first region of the wafer, the first polishing pad having a second diameter greater than the first diameter. The polishing system further includes an auxiliary polishing system comprising at least one second polishing pad that polishes a second region of the wafer, wherein the second polishing pad has a third diameter less than the first diameter, and the wafer support is configured to support the wafer during use of the first polishing pad and the auxiliary polishing system.