Kun-Tai Wu

Title: The Innovations of Kun-Tai Wu

Introduction

Kun-Tai Wu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 8 patents. His work primarily focuses on polishing systems used in the fabrication of semiconductor wafers.

Latest Patents

Among his latest patents, Wu has developed a method of using a polishing system. This method involves securing a wafer to a support, where the wafer has a first diameter. The process includes polishing the wafer with a first polishing pad that rotates about a first axis, with the pad's diameter being greater than that of the wafer. After polishing, the support is rotated about a second axis that is perpendicular to the first axis. Following this, the wafer is polished again using a second polishing pad, which has a diameter smaller than the wafer's first diameter. Finally, the wafer is released from the support after the second polishing step. Additionally, he has designed a polishing system that includes a wafer support and an auxiliary polishing system, which enhances the efficiency of the polishing process.

Career Highlights

Kun-Tai Wu has worked with notable companies in the semiconductor industry, including Taiwan Semiconductor Manufacturing Company Limited and Raydium Semiconductor Corporation. His experience in these organizations has allowed him to refine his skills and contribute to advancements in semiconductor technology.

Collaborations

Throughout his career, Wu has collaborated with talented individuals such as Shih-Chi Lin and You-Hua Chou. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Kun-Tai Wu's contributions to the semiconductor industry through his innovative polishing systems and methods have established him as a key figure in the field. His patents reflect a commitment to enhancing manufacturing processes, which is vital for the advancement of technology.