The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 14, 2022
Filed:
Jul. 18, 2019
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Shih-Chi Lin, Hsinchu, TW;
Kun-Tai Wu, Hsinchu, TW;
You-Hua Chou, Hsinchu, TW;
Chih-Tsung Lee, Hsinchu, TW;
Min Hao Hong, Kaohsiung, TW;
Chih-Jen Wu, Chu-Dong Town, TW;
Chen-Ming Huang, Hsinchu, TW;
Soon-Kang Huang, Hsinchu, TW;
Chin-Hsiang Chang, New Taipei, TW;
Chih-Yuan Yang, Hsinchu, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu, TW;
Abstract
A method of using a polishing system includes securing a wafer to a support, wherein the wafer has a first diameter. The method further includes polishing the wafer using a first polishing pad rotating about a first axis, wherein the first polishing pad has a second diameter greater than the first diameter. The method further includes rotating the support about a second axis perpendicular to the first axis after polishing the wafer using the first polishing pad. The method further includes polishing the wafer using a second polishing pad after rotating the support, wherein the second polishing pad has a third diameter less than the first diameter. The method further includes releasing the wafer from the support following polishing the wafer using the second polishing pad.