The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 01, 2017
Filed:
Dec. 06, 2012
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Shih-Chi Lin, Hsinchu, TW;
Kun-Tai Wu, Hsinchu, TW;
You-Hua Chou, Hsinchu, TW;
Chih-Tsung Lee, Hsinchu, TW;
Min Hao Hong, Kaohsiung, TW;
Chih-Jen Wu, Chu-Dong Town, TW;
Chen-Ming Huang, Hsinchu, TW;
Soon-Kang Huang, Hsinchu, TW;
Chin-Hsiang Chang, New Taipei, TW;
Chih-Yuan Yang, Hsinchu, TW;
Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B 37/04 (2012.01); B24B 37/30 (2012.01); H01L 21/304 (2006.01); H01L 21/02 (2006.01); H01L 21/673 (2006.01); H01L 21/677 (2006.01); B24B 37/20 (2012.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
B24B 37/20 (2013.01); H01L 21/02021 (2013.01); H01L 21/02024 (2013.01); H01L 21/673 (2013.01); H01L 21/67703 (2013.01); H01L 22/26 (2013.01); H01L 2924/0002 (2013.01);
Abstract
A polishing system for polishing a semiconductor wafer includes a wafer support for holding the semiconductor wafer, and a first polishing pad for polishing a region of the semiconductor wafer. The semiconductor wafer has a first diameter, and the first polishing pad has a second diameter shorter than the first diameter.