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For the Inventor, By the Inventor

Hsinchu, Taiwan

Chia-Pao Shu

This inventor holds 13 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2012-2016.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-Pao Shu. Retrieved from https://idiyas.com/inventor/chia-pao-shu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 13

% Patents Active = 76.9

Average Co-Inventor Count = 4.1

ph-index = 4

Forward Citations = 61(Granted Patents)


Location History:

  • Hsinchu, TW (2012 - 2016)
  • New Taipei, TW (2014 - 2016)

Company Filing History:

goldMedal13 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2012-2016

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13 patents (USPTO):Explore Patents
1. 9365416 - Structure and method for motion sensor (2016-06-14),
2. 9355896 - Package systems (2016-05-31),
3. 9266714 - Micro-electro mechanical system (MEMS) structures and methods of forming the same (2016-02-23),
4. 9112001 - Package systems and manufacturing methods thereof (2015-08-18),
5. 9000578 - Package systems having an opening in a substrate thereof and manufacturing methods thereof (2015-04-07),
6. 8921145 - Hybrid MEMS bump design to prevent in-process and in-use stiction (2014-12-30),
7. 8723280 - Hybrid MEMS bump design to prevent in-process and in-use stiction (2014-05-13),
8. 8716852 - Micro-electro mechanical systems (MEMS) having outgasing prevention structures and methods of forming the same (2014-05-06),
9. 8674495 - Package systems having a eutectic bonding material and manufacturing methods thereof (2014-03-18),
10. 8633554 - MEMS device etch stop (2014-01-21),
11. 8629516 - Bulk silicon moving member with dimple (2014-01-14),
12. 8368152 - MEMS device etch stop (2013-02-05),
13. 8338207 - Bulk silicon moving member with dimple (2012-12-25),

Title: Chia-Pao Shu: Innovator in Motion Sensor Technology

Introduction

Chia-Pao Shu is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in motion sensor structures and package systems. With a total of 13 patents to his name, Shu continues to push the boundaries of innovation in his industry.

Latest Patents

One of Shu's latest patents is focused on a motion sensor structure. This invention includes a first substrate with an integrated circuit, a second substrate bonded to the first, which contains the motion sensor, and a third substrate that has a recessed region aligned with the motion sensor. Another notable patent involves a package system that consists of a first substrate and a second substrate electrically coupled to it. This system incorporates a semiconductor material that includes a pad and at least one guard ring surrounding the pad, ensuring enhanced functionality and reliability.

Career Highlights

Chia-Pao Shu is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work has been instrumental in developing advanced technologies that are widely used in various applications.

Collaborations

Shu has collaborated with notable colleagues, including Kuei-Sung Chang and Chia-Ming Hung. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Chia-Pao Shu is a distinguished inventor whose work in motion sensor technology and semiconductor systems has made a lasting impact on the industry. His innovative spirit and dedication to research continue to inspire future advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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