The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 18, 2014
Filed:
Feb. 25, 2011
Chia-pao Shu, Hsinchu, TW;
Chun-wen Cheng, Zhubei, TW;
Kuei-sung Chang, Kaohsiung, TW;
Hsin-ting Huang, Bade, TW;
Shang-ying Tsai, Pingzhen, TW;
Jung-huei Peng, Jhubei, TW;
Chia-Pao Shu, Hsinchu, TW;
Chun-Wen Cheng, Zhubei, TW;
Kuei-Sung Chang, Kaohsiung, TW;
Hsin-Ting Huang, Bade, TW;
Shang-Ying Tsai, Pingzhen, TW;
Jung-Huei Peng, Jhubei, TW;
Abstract
A package system includes a first substrate. A second substrate is electrically coupled with the first substrate. At least one electrical bonding material is disposed between the first substrate and the second substrate. The at least one electrical bonding material includes a eutectic bonding material. The eutectic bonding material includes a metallic material and a semiconductor material. The metallic material is disposed adjacent to a surface of the first substrate. The metallic material includes a first pad and at least one first guard ring around the first pad.