Jung-Huei Peng

Title: Jung-Huei Peng: Innovating the World of Semiconductor MEMS Structures

Introduction:

In the world of innovations and patents, one name that stands out is Jung-Huei Peng. With a location in Jhubei, Taiwan, Peng has established himself as a leading inventor with an impressive track record and numerous contributions to the field. His vast experience and expertise in semiconductor MEMS structures have driven advancements in the industry. This article will delve into Peng's latest patents, career highlights, and collaborations, shedding light on his remarkable journey.

Latest Patents:

Jung-Huei Peng's latest patents showcase his ingenuity in creating efficient and technologically advanced solutions in the realm of semiconductor MEMS structures. Two notable patents are as follows:

1. Semiconductor MEMS Structure: This patent encompasses a structure that consists of a cavity enclosed by a first substrate and an opposing second substrate. It further includes a feature protruding from the surface of the first substrate, with a dielectric layer covering the feature. The dielectric layer features a surface in contact with the feature and another surface positioned towards the cavity. This innovative structure brings forward immense potential for various semiconductor applications.

2. Structure for Integrated Microphone: In this patent, Peng presents an integrated microphone structure comprising a first silicon substrate patterned as a first plate. A silicon oxide layer is formed on one side of the first silicon substrate. A second silicon substrate is then bonded to the first substrate, sandwiching the silicon oxide layer between the two substrates. A diaphragm is secured on the silicon oxide layer, forming a capacitive microphone alongside the first plate. This invention has the potential to revolutionize the field of microphones, enhancing sound capturing capabilities.

Career Highlights:

Jung-Huei Peng's career is filled with significant achievements and contributions to the field of semiconductor technology. He has been a valued member of Taiwan Semiconductor Manufacturing Company Ltd. (TSMC), a world-renowned semiconductor manufacturing company. His association with TSMC has allowed him to work on ground-breaking projects and collaborate with industry leaders.

Collaborations:

Peng's collaborative nature has helped him develop relationships with fellow innovators, resulting in pioneering advancements. Notably, he has worked with esteemed colleagues, such as Shang-Ying Tsai and Chun-Wen Cheng. Their collective efforts have synergistically contributed to the development of cutting-edge technologies and patentable inventions.

Conclusion:

Jung-Huei Peng's remarkable journey in the world of semiconductor MEMS structures is truly inspirational. With 95 patents to his name, including recent inventions like the semiconductor MEMS structure and the structure for an integrated microphone, Peng continues to push the boundaries of innovation. Through his career at TSMC and collaborations with industry leaders, he has solidified his position as a trailblazer in the field. With these achievements and ongoing dedication, Peng's contributions to the semiconductor industry are set to make a lasting impact and shape the future of technology.