Shang-Ying Tsai

This inventor holds 92 USPTO granted patents and 8 published patent applications, primarily in MEMS Technology (CPC class B81B2201-0235). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Illumina Corporation. Active years: 2011-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shang-Ying Tsai. Retrieved from https://idiyas.com/inventor/shang-ying-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 92 (Patent Applications = 8)

% Patents Active = 66.3

Average Co-Inventor Count = 4.8

ph-index = 8

Forward Citations = 506(Granted Patents)

Forward Citations (Not Self Cited) = 419(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Jhongli, TW (2011 - 2015)
Pingzheng, TW (2015)
Jhonglie, TW (2017)
Taoyuan, TW (2020)
Taoyuan County, TW (2014 - 2023)
Pingzhen, TW (2013 - 2024)

Company Filing History:

88 out of 42,926

Taiwan Semiconductor Manufacturing Comp. Ltd.

where one patent can have more than one assignee

Years Active: 2011-2026

Loading Chart...

Areas of Expertise:

MEMS Device

Shock Absorption

Micro-Fluidic Structure

Thermocouple

Wafer Chuck

Composite Spring

Stiction Prevention

Optical Alignment

Semiconductor Manufacturing

Chemical Pattern

Mechanical Robustness

Conductive Feature

92 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12747153 - Composite spring structure to reinforce mechanical robustness of a mems device (2026-09-29),

2. 12497285 - Stopper bump structures for MEMS device (2025-12-16),

3. 12412863 - Die attached leveling control by metal stopper bumps (2025-09-09),

4. 12358783 - Wire-bond damper for shock absorption (2025-07-15),

5. 12322722 - Die attached leveling control by metal stopper bumps (2025-06-03),

6. 12303888 - Method to produce chemical pattern in micro-fluidic structure (2025-05-20),

7. 12191185 - Vacuum wafer chuck for manufacturing semiconductor devices (2025-01-07),

8. 11993510 - Composite spring structure to reinforce mechanical robustness of a MEMS device (2024-05-28),

9. 11987494 - Wire-bond damper for shock absorption (2024-05-21),

10. 11923331 - Die attached leveling control by metal stopper bumps (2024-03-05),

11. 11765975 - Thermocouple device (2023-09-19),

12. 11713242 - MEMS device with dummy-area utilization for pressure enhancement (2023-08-01),

13. 11661333 - Semiconductor structure and manufacturing method thereof (2023-05-30),

14. 11591211 - Semiconductive structure and manufacturing method thereof (2023-02-28),

15. 11542151 - MEMS apparatus with anti-stiction layer (2023-01-03),

Title: The Innovative Journey of Shang-Ying Tsai

Introduction: Shang-Ying Tsai is a renowned inventor hailing from Pingzhen, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Shang-Ying Tsai holds several patents in the areas of electronics, renewable energy, and sustainable technologies, showcasing his commitment to creating a more efficient and eco-friendly world.

Career Highlights: With a career spanning over two decades, Shang-Ying Tsai has worked with leading tech companies and research institutions, where he has spearheaded projects that have revolutionized the industry.

Collaborations: Throughout his career, Shang-Ying Tsai has collaborated with top engineers, scientists, and designers, fostering a culture of innovation and excellence in all his projects.

Conclusion: Shang-Ying Tsai's relentless pursuit of innovation and his passion for creating a positive impact on society make him a true pioneer in the world of technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

8 patents pending: