The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 16, 2025

Filed:

Mar. 09, 2022
Applicant:

Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;

Inventors:

Wei-Jhih Mao, Taipei, TW;

Shang-Ying Tsai, Pingzhen, TW;

Kuei-Sung Chang, Kaohsiung, TW;

Chun-Wen Cheng, Zhubei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 3/00 (2006.01); B81B 7/00 (2006.01);
U.S. Cl.
CPC ...
B81B 3/0051 (2013.01); B81B 7/0016 (2013.01); B81B 2207/03 (2013.01);
Abstract

Various embodiments of the present disclosure are directed towards an integrated chip (IC) including a substrate. A plurality of adhesive structures is disposed on the substrate. A microelectromechanical systems (MEMS) structure is disposed on the adhesive structures. The MEMS structure comprises a movable element disposed within a cavity. A first plurality of stopper bumps is disposed between the movable element and the substrate.


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Mao, Wei-Jhih. (2025). Stopper bump structures for mems device (U.S. Patent No. 12497285). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12497285

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