Wei-Jhih Mao

Title: Innovations of Wei-Jhih Mao

Introduction

Wei-Jhih Mao is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of microelectromechanical systems (MEMS) and integrated chip technology. With a total of nine patents to his name, Mao's work has had a considerable impact on the semiconductor industry.

Latest Patents

Mao's latest patents include innovative technologies that enhance the performance and reliability of integrated circuits. One of his notable inventions is the "Die attached leveling control by metal stopper bumps." This patent describes an integrated chip that features a substrate and a first die, with a plurality of die stopper bumps that ensure proper alignment and stability. Another significant patent is the "Wire-bond damper for shock absorption," which details a MEMS package designed to mitigate shock to movable masses within the system. This invention includes a wire-bond damper that effectively dampens vibrations, enhancing the durability of MEMS structures.

Career Highlights

Wei-Jhih Mao is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His work at this company has allowed him to collaborate on cutting-edge technologies that push the boundaries of what is possible in chip design and manufacturing.

Collaborations

Mao has worked alongside talented colleagues such as Kuei-Sung Chang and Shang-Ying Tsai. Their collaborative efforts have contributed to the development of innovative solutions in the semiconductor field.

Conclusion

Wei-Jhih Mao's contributions to the field of integrated circuits and MEMS technology are noteworthy. His patents reflect a commitment to innovation and excellence in semiconductor design. His work continues to influence the industry and pave the way for future advancements.