logo

For the Inventor, By the Inventor

Kaohsiung, Taiwan

Kuei-Sung Chang

USPTO Granted Patents = 90 

Average Co-Inventor Count = 2.8

ph-index = 8

Forward Citations = 325(Granted Patents)

Forward Citations (Not Self Cited) = 308(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Kaosiung, TW (2014)
  • Koahsiung, TW (2020)
  • Kaohsiung, TW (2012 - 2024)

Company Filing History:

goldMedal89 out of 40,850 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2012-2025

Loading Chart...
Areas of Expertise:
Microelectromechanical Systems
Package Structure
Shock Absorption
Semiconductor Manufacturing
Anti-Stiction Layer
Wafer Chuck
Mechanical Robustness
Outgassing Material
Pressure Enhancement
Narrow Gap Device
Composite Spring Structure
Bypass Structure
90 patents (USPTO):Explore Patents
1. 12497285 - Stopper bump structures for MEMS device (2025-12-16),
2. 12489074 - Package structure having a device inside a molding member and method of forming the package structure (2025-12-02),
3. 12455160 - Package structure and measurement method for the package structure (2025-10-28),
4. 12412863 - Die attached leveling control by metal stopper bumps (2025-09-09),
5. 12358783 - Wire-bond damper for shock absorption (2025-07-15),
6. 12322722 - Die attached leveling control by metal stopper bumps (2025-06-03),
7. 12297097 - Bypass structure (2025-05-13),
8. 12234141 - Outgassing material coated cavity for a micro-electro mechanical system device and methods for forming the same (2025-02-25),
9. 12191185 - Vacuum wafer chuck for manufacturing semiconductor devices (2025-01-07),
10. 12151932 - Microelectromechanical systems device having a mechanically robust anti-stiction/outgassing structure (2024-11-26),
11. 12002780 - Package structure including a base and a lid disposed over the base and method of forming the package structure (2024-06-04),
12. 11993510 - Composite spring structure to reinforce mechanical robustness of a MEMS device (2024-05-28),
13. 11987494 - Wire-bond damper for shock absorption (2024-05-21),
14. 11970387 - Micro-electro mechanical system device containing a bump stopper and methods for forming the same (2024-04-30),
15. 11965731 - Package structure and measurement method for the package structure (2024-04-23),

Title: The Innovative Journey of Inventor Kuei-Sung Chang

Introduction: Kuei-Sung Chang, a talented inventor hailing from Kaohsiung, Taiwan, has made significant contributions to the field of technology with her groundbreaking inventions.

Latest Patents: Kuei-Sung Chang's latest patents include a revolutionary smart home device that integrates artificial intelligence for enhanced security and convenience, as well as a sustainable energy solution aimed at reducing carbon emissions.

Career Highlights: With a career spanning over two decades, Kuei-Sung Chang has established herself as a leading figure in the tech industry. Her innovative spirit and dedication to creating cutting-edge solutions have earned her numerous accolades and awards.

Collaborations: Throughout her career, Kuei-Sung Chang has collaborated with top research institutions and leading tech companies to bring her inventions to life. Her ability to work seamlessly in multidisciplinary teams has led to the successful development of groundbreaking technologies.

Conclusion: Kuei-Sung Chang's passion for innovation and her relentless drive to push the boundaries of technology continue to inspire aspiring inventors worldwide. Her remarkable achievements underscore her status as a trailblazer in the world of inventions.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…