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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11965731 B1

PDFFull Text
Date of Patent:
Apr. 23, 2024

Filed:

Mar. 14, 2021

Package structure and measurement method for the package structure

Applicant:

Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;

Inventor:

Kuei-Sung Chang, Kaohsiung, TW;

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;

Attorneys:

WPAT LAW

Anthony King

Primary Examiner:

Gordon J Stock, Jr

Int. Cl.
CPC ...
G01B 11/14 (2006.01); G01B 21/16 (2006.01); H01L 21/48 (2006.01); H01L 21/50 (2006.01); H01L 21/56 (2006.01); H01L 21/66 (2006.01); H01L 23/04 (2006.01); H01L 23/043 (2006.01); H01L 23/28 (2006.01); G01B 7/31 (2006.01);
U.S. Cl.
CPC ...
G01B 11/14 (2013.01); G01B 21/16 (2013.01); H01L 21/4817 (2013.01); H01L 21/50 (2013.01); H01L 21/56 (2013.01); H01L 22/12 (2013.01); H01L 23/04 (2013.01); H01L 23/043 (2013.01); H01L 23/28 (2013.01); G01B 7/31 (2013.01);
Abstract

The present disclosure provides a measurement method including providing a base, a device disposed on the base, and a lid disposed over the base and the device; irradiating a top surface of the device through an opening of the lid to obtain a first focal plane associated with a top surface of the device; irradiating the lid at the lower end of the opening to obtain a second focal plane associated with the lid at the lower end of the opening; and deriving a distance between the top surface of the device and an interior surface of the lid facing the top surface of the device based on a difference between a level of the first focal plane and a level of the second focal plane. The present disclosure also provides a package structure for the measurement.

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