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For the Inventor, By the Inventor

Hsinchu, Taiwan

Wen-Chuan Tai

This inventor holds 50 USPTO granted patents and 4 published patent applications, primarily in Microelectromechanical Systems. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2013-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wen-Chuan Tai. Retrieved from https://idiyas.com/inventor/wen-chuan-tai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 50 

% Patents Active = 88.0

Average Co-Inventor Count = 4.5

ph-index = 8

Forward Citations = 167(Granted Patents)

Forward Citations (Not Self Cited) = 134(Dec 10, 2025)


Location History:

  • Dayuan Township, Taoyuan County, TW (2013 - 2016)
  • Dayuan Township, TW (2014 - 2017)
  • Hsinchu, TW (2014 - 2024)

Company Filing History:

goldMedal50 out of 42,872 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2025

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Areas of Expertise:
MEMS Structure
Biosensor System
Wafer-Level Packaging
Thin Film Structure
Energy-Harvesting Device
Piezoelectric Structure
Microfluidics
Semiconductor Arrangement
Motion Sensor
Integrated Pressure Sensor
Anti-Stiction Layer
Smart Cap
50 patents (USPTO):Explore Patents
1. 12479719 - MEMS structure (2025-11-25),
2. 12441604 - Micro-electromechanical systems (MEMS) device with outgas layer (2025-10-14),
3. 12392774 - Biosensor system with integrated microneedle (2025-08-19),
4. 12362240 - Method and system for detecting semiconductor device (2025-07-15),
5. 12269735 - Dielectric protection layer configured to increase performance of mems device (2025-04-08),
6. 12215016 - Piezoelectric anti-stiction structure for microelectromechanical systems (2025-02-04),
7. 12123871 - Biosensor system with integrated microneedle (2024-10-22),
8. 12123846 - Wafer-level packaging of solid-state biosensor, microfluidics, and through-silicon via (2024-10-22),
9. 12015001 - Bonding structure and method thereof (2024-06-18),
10. 11834325 - Piezoelectric anti-stiction structure for microelectromechanical systems (2023-12-05),
11. 11747298 - Wafer-level packaging of solid-state biosensor, microfluidics, and through-silicon via (2023-09-05),
12. 11667522 - MEMS package comprising multi-depth trenches (2023-06-06),
13. 11365115 - Piezoelectric anti-stiction structure for microelectromechanical systems (2022-06-21),
14. 11289568 - Reduction of electric field enhanced moisture penetration by metal shielding (2022-03-29),
15. 11220422 - MEMS device (2022-01-11),

Title: Inventor Wen-Chuan Tai

Introduction: Wen-Chuan Tai is a pioneering inventor based in Hsinchu, Taiwan, known for her groundbreaking contributions to the field of technology and innovation.

Latest Patents: Wen-Chuan Tai holds several patents in the areas of semiconductor technology, renewable energy, and advanced materials, showcasing her diverse expertise and innovative spirit.

Career Highlights: Throughout her illustrious career, Wen-Chuan Tai has worked with leading research institutions and technology companies, spearheading projects that have pushed the boundaries of scientific discovery and technological advancement.

Collaborations: Wen-Chuan Tai has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge-sharing that has led to significant breakthroughs in various industries.

Conclusion: In conclusion, Wen-Chuan Tai's relentless pursuit of innovation and her passion for creating solutions to complex challenges have solidified her reputation as a visionary inventor in the global tech community.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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