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For the Inventor, By the Inventor

Bade, Taiwan

Hsin-Ting Huang

USPTO Granted Patents = 35

Average Co-Inventor Count = 6.3

ph-index = 8

Forward Citations = 382(Granted Patents)


Location History:

  • Taoyuan County, TW (2015 - 2019)
  • Bade, TW (2013 - 2021)

Company Filing History:

goldMedal35 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2021

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35 patents (USPTO):
1. 11130670 - MEMS devices with an element having varying widths (2021-09-28),
2. 10981781 - Semiconductor arrangement and formation thereof (2021-04-20),
3. 10464808 - Semiconductor arrangement and formation thereof (2019-11-05),
4. 10392244 - Method for sealing a cavity of a microelectromechanical systems (MEMS) device using a seal layer covering or lining a hole in fluid communication with the cavity (2019-08-27),
5. 10266395 - Semiconductive structure and manufacturing method thereof (2019-04-23),
6. 10266390 - Methods of forming micro-electro-mechanical devices including a conductive feature extending through an escort ring (2019-04-23),
7. 10131540 - Structure and method to mitigate soldering offset for wafer-level chip scale package (WLCSP) applications (2018-11-20),
8. 9856139 - Microelectromechanical systems (MEMS) devices at different pressures (2018-01-02),
9. 9845236 - Monolithic MEMS platform for integrated pressure, temperature, and gas sensor (2017-12-19),
10. 9776858 - Semiconductor arrangement and formation thereof (2017-10-03),
11. 9714166 - Thin film structure for hermetic sealing (2017-07-25),
12. 9673169 - Method and apparatus for a wafer seal ring (2017-06-06),
13. 9656857 - Microelectromechanical systems (MEMS) devices at different pressures (2017-05-23),
14. 9630832 - Semiconductor device and method of manufacturing (2017-04-25),
15. 9584003 - Energy-harvesting device (2017-02-28),

Title: Innovator Spotlight: Hsin-Ting Huang

Introduction: Hsin-Ting Huang is a prominent inventor based in Bade, Taiwan, recognized for his groundbreaking contributions to the field of Micro-Electro-Mechanical Systems (MEMS) and semiconductor technology. With an impressive portfolio of 35 patents, he continues to drive innovation at Taiwan Semiconductor Manufacturing Company Ltd.

Latest Patents: Hsin-Ting Huang's latest inventions include advanced MEMS devices featuring an innovative design that incorporates elements with varying widths. One of his notable patents describes a device composed of a substrate, a routing conductive line, a dielectric layer, and an etch stop layer. This design includes a Micro-Electro-Mechanical System (MEMS) device portion over the etch stop layer, with a contact plug that connects this portion to the routing conductive line, enhancing performance and reliability.

Another significant patent focuses on semiconductor arrangements and their formation. This invention details a semiconductor arrangement that integrates a MEMS device in a dedicated MEMS area, significantly improving conductivity and reducing processing requirements compared to traditional methods. The invention also features a vacuum-sealed cap over the MEMS area, enhancing the overall functionality of the device while minimizing outgassing issues.

Career Highlights: Hsin-Ting Huang has made substantial impacts in the semiconductor sector throughout his career. His role at Taiwan Semiconductor Manufacturing Company Ltd. has positioned him as a key contributor to advancements in MEMS and semiconductor technologies, fostering innovations that influence various applications in the industry.

Collaborations: Huang works alongside esteemed colleagues such as Shang-Ying Tsai and Jung-Huei Peng, whose collaborative efforts contribute to the ongoing success of their projects and the development of cutting-edge technologies at their company.

Conclusion: Hsin-Ting Huang exemplifies the spirit of innovation that drives technological advancements in the semiconductor industry. With his extensive patent portfolio and dedication to research and development, he continues to make significant strides in the world of MEMS and semiconductor solutions, influencing the future of the industry.

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