The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 19, 2017

Filed:

Mar. 12, 2015
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Shao-Chi Yu, Hsinchu, TW;

Chia-Ming Hung, Taipei, TW;

Hsin-Ting Huang, Bade, TW;

Hsiang-Fu Chen, Zhubei, TW;

Allen Timothy Chang, Hsinchu, TW;

Wen-Chuan Tai, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); G01L 19/00 (2006.01); B81B 7/02 (2006.01); G01L 9/00 (2006.01); G01K 13/00 (2006.01); G01N 27/22 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00269 (2013.01); B81B 7/02 (2013.01); G01K 13/00 (2013.01); G01L 9/0073 (2013.01); G01L 19/0092 (2013.01); G01N 27/221 (2013.01); B81B 2201/0214 (2013.01); B81B 2201/0264 (2013.01); B81B 2201/0278 (2013.01); B81B 2207/096 (2013.01); B81C 2203/0109 (2013.01); G01N 2027/222 (2013.01);
Abstract

The present disclosure is directed to a monolithic MEMS (micro-electromechanical system) platform having a temperature sensor, a pressure sensor and a gas sensor, and an associated method of formation. In some embodiments, the MEMS platform includes a semiconductor substrate having one or more transistor devices and a temperature sensor. A dielectric layer is disposed over the semiconductor substrate. A cavity is disposed within an upper surface of the dielectric layer. A MEMS substrate is arranged onto the upper surface of the dielectric layer and has a first section and a second section. A pressure sensor has a first pressure sensor electrode that is vertically separated by the cavity from a second pressure sensor electrode within the first section of a MEMS substrate. A gas sensor has a polymer disposed between a first gas sensor electrode within the second section of a MEMS substrate and a second gas sensor electrode.


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