The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 31, 2016
Filed:
Jul. 31, 2015
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Chia-Pao Shu, Hsinchu, TW;
Chun-wen Cheng, Zhubei, TW;
Kuei-Sung Chang, Kaohsiung, TW;
Hsin-Ting Huang, Bade, TW;
Shang-Ying Tsai, Pingzhen, TW;
Jung-Huei Peng, Jhubei, TW;
Abstract
A package system includes a first substrate; and a second substrate electrically coupled with the first substrate. The package system further includes a semiconductor material between the first substrate and the second substrate. The semiconductor material includes a pad, and at least one guard ring surrounding the pad and spaced from the pad. The package system further includes a metallic material bonded to the semiconductor material, wherein the metallic material at least partially fills at least one opening in at least one of the first substrate or the second substrate.