The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2015
Filed:
Oct. 08, 2010
Applicants:
Chia-pao Shu, Hsinchu, TW;
Chun-wen Cheng, Zhubei, TW;
Kuei-sung Chang, Kaohsiung, TW;
Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H01L 23/52 (2006.01); B81C 1/00 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/83 (2013.01); B81C 1/00238 (2013.01); B81C 1/00269 (2013.01); B81C 2203/019 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/06 (2013.01); H01L 24/29 (2013.01); H01L 24/30 (2013.01); H01L 24/32 (2013.01); H01L 24/94 (2013.01); H01L 25/0657 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03452 (2013.01); H01L 2224/0362 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/05551 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/05557 (2013.01); H01L 2224/05617 (2013.01); H01L 2224/05638 (2013.01); H01L 2224/061 (2013.01); H01L 2224/26145 (2013.01); H01L 2224/29017 (2013.01); H01L 2224/2902 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29117 (2013.01); H01L 2224/29124 (2013.01); H01L 2224/29138 (2013.01); H01L 2224/29144 (2013.01); H01L 2224/29147 (2013.01); H01L 2224/29155 (2013.01); H01L 2224/29166 (2013.01); H01L 2224/29181 (2013.01); H01L 2224/29291 (2013.01); H01L 2224/32058 (2013.01); H01L 2224/321 (2013.01); H01L 2224/32106 (2013.01); H01L 2224/32148 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83365 (2013.01); H01L 2224/83805 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01014 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01037 (2013.01); H01L 2924/01049 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01073 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1461 (2013.01);
Abstract
A package system includes a first substrate and a second substrate. The second substrate is electrically coupled with the first substrate. The second substrate includes at least one first opening. At least one electrical bonding material is disposed between the first substrate and the second substrate. A first portion of the at least one electrical bonding material is at least partially filled in the at least one first opening.
Shu, Chia-Pao. (2015). Package systems having an opening in a substrate thereof and manufacturing methods thereof (U.S. Patent No. 9000578). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9000578
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile