Xinfeng, China

Chia-En Huang

This inventor holds 169 USPTO granted patents and 61 published patent applications, primarily in Semiconductor Memory (CPC class H10B51-20). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2014-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Chia-En Huang. Retrieved from https://idiyas.com/inventor/chia-en-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 169 

% Patents Active = 89.9

Average Co-Inventor Count = 3.4

ph-index = 4

Forward Citations = 217(Granted Patents)

Forward Citations (Not Self Cited) = 158(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Xinfen Township, TW (2015)
  • Xingfeng Township, TW (2015)
  • Xinfeng, TW (2023)
  • Xinfeng Township, TW (2014 - 2024)
  • Hsinchu County, TW (2015 - 2024)
  • Hsinchu, TW (2016 - 2024)

Company Filing History:


Years Active: 2014-2026

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Areas of Expertise:
Semiconductor Memory
3D Memory
Differential Threshold Voltage
Antifuse Structure
Capacitive Loading
Vertical Integration
MIM eFuse
Dielectric Fin Structures
Memory Array
One-Time-Programmable
Routing Rails
Memory Devices
169 patents (USPTO):Explore Patents

Title: Innovations of Chia-En Huang in Semiconductor Memory Technologies

Introduction

Chia-En Huang, based in Xinfeng, China, is a prolific inventor in the field of semiconductor memory technologies, boasting an impressive portfolio of 143 patents. His work has significantly contributed to advancements in memory systems, particularly in vertical integration and different doping types in semiconductor devices.

Latest Patents

Among Chia-En Huang's latest patents, two noteworthy inventions stand out. The first is a memory device characterized by vertical integration, comprising a first layer that contains a memory array, row decoder circuit, and column sensing circuit. A second layer is strategically positioned above the first, featuring a peripheral circuit that is operatively connected to the first layer. This invention enhances memory device efficiency through its unique interconnect structures that facilitate communication between layers.

The second patent focuses on semiconductor devices with varying doping types. This innovative design includes vertically separated nanostructures and gate structures that wrap around these nanostructures. The invention incorporates different drain/source structures that are configured to optimize performance through complementary doping types, allowing for enhanced electronic characteristics and improved functionality.

Career Highlights

Chia-En Huang has demonstrated his expertise through substantial contributions during his professional tenure at leading companies in the semiconductor industry, specifically at Taiwan Semiconductor Manufacturing Company Limited. His work in leading-edge technology has positioned him as a pivotal figure in semiconductor memory development.

Collaborations

Throughout his career, Chia-En Huang has collaborated with esteemed colleagues such as Yih Wang and Meng-Sheng Chang. These partnerships have fostered an environment of innovation and knowledge-sharing, enabling the development of groundbreaking semiconductor technologies.

Conclusion

Chia-En Huang’s extensive patent portfolio and innovative contributions to semiconductor memory systems underline his significant role in technology advancement. His commitment to pushing the boundaries of memory devices continues to shape the future of the semiconductor industry. As he continues to innovate, the impact of his work will likely resonate throughout the field for years to come.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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