Company Filing History:
6 out of 124 
3 out of 234 
Years Active: 2007-2016
Title: The Innovations of Chi Ming Chong
Introduction
Chi Ming Chong is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of electronic device assembly, holding a total of 9 patents. His work focuses on enhancing the efficiency and effectiveness of die bonding processes.
Latest Patents
Chi Ming Chong's latest patents include a die bonder and a method of cleaning a bond collet. The die bonder features a movable bond collet designed to hold an electronic device. It also includes a platform with a cleaning surface that cleans the bond collet upon contact. Additionally, the die bonder is equipped with a cleaning agent supply that facilitates the cleaning process. Another significant patent involves an apparatus and method for determining the alignment of a bondhead of a die bonder relative to a workchuck. This apparatus comprises a sensor that measures the distance between the bondhead and the sensor, along with a positioning device that allows for precise positioning of the sensor relative to various locations on the bondhead.
Career Highlights
Throughout his career, Chi Ming Chong has worked with prominent companies such as ASM Assembly Automation Limited and ASM Technology Singapore Pte Ltd. His experience in these organizations has contributed to his expertise in the field of die bonding technology.
Collaborations
Chi Ming Chong has collaborated with several professionals in his field, including Yiu Ming Cheung and Man Wai Chan. These collaborations have likely enriched his work and led to innovative solutions in electronic device assembly.
Conclusion
Chi Ming Chong's contributions to the field of die bonding technology are noteworthy. His patents reflect a commitment to improving electronic device assembly processes. His work continues to influence the industry positively.