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For the Inventor, By the Inventor

Hong Kong, China

Asm Assembly Automation Limited


USPTO Granted Patents = 124

% Expired Patents = 0.81


Forward Citations = 856

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204 inventors (with patents filed for the assignee):

goldMedal Chi Wah Cheng (24 out of 51 patents)

silverMedal Gary Peter Widdowson (14 out of 34 patents)

bronzeMedal Yiu Ming Cheung (13 out of 19 patents)

4.  Pei Wei Tsai (7 out of 12 patents)

5.  Chak Tong Albert Sze (7 out of 7 patents)

6.  Lap Kei Eric Chow (7 out of 7 patents)

7.  Wai Chuen Gan (7 out of 8 patents)

8.  Deming Liu (7 out of 7 patents)

9.  Kui Kam Lam (6 out of 16 patents)

10.  Yuk Cheung Au (6 out of 7 patents)

11.  Chi Ming Chong (6 out of 9 patents)

12.  Chou Kee Peter Liu (6 out of 6 patents)

13.  Wing Fai Lam (6 out of 20 patents)

14.  Wing Hong Leung (5 out of 8 patents)

15.  Tim Wai Tony Mak (5 out of 5 patents)


Core Competencies:
Die Bonding
Cleaning System
Electronic Components
Thermal Control
Alignment Method
Vision System
Dispensing Apparatus
Handling System
Semiconductor Devices
Test Handler
Rotary Bonding Tool
Acoustic Cleaning

124 patents:

1. 8978673 - Megasonic cleaning system (2015-03-17),
2. 8794563 - Integrated connector assembly for a rotary apparatus (2014-08-05),
3. 8766192 - Method for inspecting a photovoltaic substrate (2014-07-01),
4. 8749249 - Test handler for electronic devices (2014-06-10),
5. 8729745 - Multiple-phase linear switched reluctance motor (2014-05-20),
6. 8702017 - Nozzle device employing high frequency wave energy (2014-04-22),
7. 8692426 - Direct current motor incorporating thermal control (2014-04-08),
8. 8651159 - Die bonder providing a large bonding force (2014-02-18),
9. 8633441 - Die bonding process incorporating infrared vision system (2014-01-21),
10. 8633089 - Die bonding method utilizing rotary wafer table (2014-01-21),
11. 8470130 - Universal die detachment apparatus (2013-06-25),
12. 8397785 - Transfer apparatus for multiple adhesives (2013-03-19),
13. 8354612 - Laser processing apparatus (2013-01-15),
14. 8336757 - Apparatus for transporting substrates for bonding (2012-12-25),
15. 8324848 - System for maintaining thermal stability of a motion stage (2012-12-04),
Asm Assembly Automation Limited, based in Hong Kong, specializes in die bonding technology, focusing on the precision assembly of electronic components. The company develops advanced systems for die bonding, incorporating innovative cleaning systems, thermal control mechanisms, and alignment methods. Their expertise extends to vision systems and dispensing apparatuses, ensuring high efficiency and accuracy in handling systems. Asm is committed to enhancing manufacturing processes in the electronics sector through cutting-edge automation solutions.
Profile summary based on public USPTO records.

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USPTO Data Jan 1 1976 - Oct 6 2026

124 Patents

#25 in Hong Kong

#278 in China

#6,457 in the World

Hong Kong, CN
Hong Kong, China

Asm Assembly Automation Limited

Forward Citations = 856

204 inventors:

goldMedal Chi Wah Cheng (24 out of 51 patents)

silverMedal Gary Peter Widdowson (14 out of 34 patents)

bronzeMedal Yiu Ming Cheung (13 out of 19 patents)

4.  Pei Wei Tsai (7 out of 12 patents)

5.  Chak Tong Albert Sze (7 out of 7 patents)

Please report any incorrect information to [email protected]
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