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For the Inventor, By the Inventor

Hong Kong, China

Asm Assembly Automation Limited


USPTO Granted Patents = 124


Forward Citations = 838

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204 inventors (with patents filed for the assignee):

goldMedal Chi Wah Cheng (24 out of 51 patents)

silverMedal Gary Peter Widdowson (14 out of 33 patents)

bronzeMedal Yiu Ming Cheung (13 out of 19 patents)

4.  Pei Wei Tsai (7 out of 12 patents)

5.  Chak Tong Albert Sze (7 out of 7 patents)

6.  Lap Kei Eric Chow (7 out of 7 patents)

7.  Wai Chuen Gan (7 out of 8 patents)

8.  Deming Liu (7 out of 7 patents)

9.  Kui Kam Lam (6 out of 16 patents)

10.  Yuk Cheung Au (6 out of 7 patents)

11.  Chi Ming Chong (6 out of 9 patents)

12.  Chou Kee Peter Liu (6 out of 6 patents)

13.  Wing Fai Lam (6 out of 19 patents)

14.  Wing Hong Leung (5 out of 8 patents)

15.  Tim Wai Tony Mak (5 out of 5 patents)


Core Competencies:
Megasonic Cleaning
Integrated Connector Assembly
Photovoltaic Inspection
Test Handler
Switched Reluctance Motor
High Frequency Nozzle Device
Thermal Control Motor
Die Bonder Technology
Laser Processing Apparatus
Electronic Component Transfer
Vision System for Inspection
Bonding Semiconductor Devices

124 patents:

1. 8978673 - Megasonic cleaning system (2015-03-17),
2. 8794563 - Integrated connector assembly for a rotary apparatus (2014-08-05),
3. 8766192 - Method for inspecting a photovoltaic substrate (2014-07-01),
4. 8749249 - Test handler for electronic devices (2014-06-10),
5. 8729745 - Multiple-phase linear switched reluctance motor (2014-05-20),
6. 8702017 - Nozzle device employing high frequency wave energy (2014-04-22),
7. 8692426 - Direct current motor incorporating thermal control (2014-04-08),
8. 8651159 - Die bonder providing a large bonding force (2014-02-18),
9. 8633441 - Die bonding process incorporating infrared vision system (2014-01-21),
10. 8633089 - Die bonding method utilizing rotary wafer table (2014-01-21),
11. 8470130 - Universal die detachment apparatus (2013-06-25),
12. 8397785 - Transfer apparatus for multiple adhesives (2013-03-19),
13. 8354612 - Laser processing apparatus (2013-01-15),
14. 8336757 - Apparatus for transporting substrates for bonding (2012-12-25),
15. 8324848 - System for maintaining thermal stability of a motion stage (2012-12-04),
ASM Assembly Automation Limited is a leading global supplier of manufacturing solutions for electronic assembly and industrial markets. With over 40 years of experience, ASM Assembly Automation offers a wide range of innovative products and services including SMT placement systems, dispensing and soldering equipment, and process software. Their solutions are designed to optimize production efficiency, improve quality, and reduce costs. Visit their website to learn more about ASM Assembly Automation and explore their comprehensive range of assembly solutions.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 23 2025

124 Patents

#25 in Hong Kong

#254 in China

#6,270 in the World

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Hong Kong, China

Asm Assembly Automation Limited

Forward Citations = 838

204 inventors:

goldMedal Chi Wah Cheng (24 out of 51 patents)

silverMedal Gary Peter Widdowson (14 out of 33 patents)

bronzeMedal Yiu Ming Cheung (13 out of 19 patents)

4.  Pei Wei Tsai (7 out of 12 patents)

5.  Chak Tong Albert Sze (7 out of 7 patents)

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