Hong Kong, China

Yiu Ming Cheung

USPTO Granted Patents = 19 


Average Co-Inventor Count = 2.8

ph-index = 8

Forward Citations = 154(Granted Patents)


Location History:

  • Kwai Chung, CN (2004 - 2005)
  • Hong Kong, CN (2001 - 2023)

Company Filing History:


Years Active: 2001-2023

Loading Chart...
Loading Chart...
19 patents (USPTO):Explore Patents

Title: Innovations of Yiu Ming Cheung: A Look at His Patents and Contributions

Introduction

Yiu Ming Cheung, an accomplished inventor based in Hong Kong, has made significant contributions to the field of technology with a remarkable portfolio of 19 patents. His innovative ideas focus primarily on processes that enhance efficiency and functionality in electronic assembly and manufacturing.

Latest Patents

Among his latest inventions is the patent for "Detaching a die from an adhesive tape by air ejection." In this innovative process, a collet of a pick arm is positioned over a die mounted on the first surface of an adhesive tape. By generating a flow of air onto the second surface of the adhesive tape, the die is displaced towards the die-holding surface of the collet. This method allows the die to be retained while the adhesive tape is separated effortlessly.

Another significant patent is the "Gang bonding process for assembling a matrix of light-emitting elements." This method involves bonding a matrix of light-emitting elements onto a substrate by forming conductive material on bond pads in a matrix arrangement. Using a temporary carrier, the light-emitting elements are placed and held in place by a bond head, which moves to make contact with the conductive material. When heat and compressive force are applied, conductive joints are formed, leading to a more efficient assembly process.

Career Highlights

Yiu Ming Cheung has had an impressive career working for prominent companies such as ASM Assembly Automation Limited and ASM Technology Singapore Pte Ltd. His work at these organizations has allowed him to develop and refine his innovative techniques, contributing to the advancement of technology in electronic manufacturing.

Collaborations

Throughout his career, Cheung has collaborated with talented professionals such as Ming Li and Chi Ming Chong. Their collective expertise has enabled them to tackle complex challenges in the realm of electronic assembly, resulting in several impactful innovations.

Conclusion

Yiu Ming Cheung exemplifies the spirit of innovation through his dedication to improving manufacturing processes and technologies. With numerous patents to his name, his work is a testament to the importance of creativity and collaboration in advancing industry standards. As he continues to push the boundaries of what is possible, Cheung remains an influential figure in the field of electronic assembly.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…