The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 03, 2015
Filed:
Apr. 17, 2012
Yiu Ming Cheung, Kowloon, HK;
Tsan Yin Peter Lo, Kwai Chung, HK;
Ming LI, Kwai Chung, HK;
Yick Hong Mak, Hong Kong, HK;
Ka San Lam, Kowloon, HK;
Yiu Ming Cheung, Kowloon, HK;
Tsan Yin Peter Lo, Kwai Chung, HK;
Ming Li, Kwai Chung, HK;
Yick Hong Mak, Hong Kong, HK;
Ka San Lam, Kowloon, HK;
ASM Technology Singapore Pte Ltd, Singapore, SG;
Abstract
A die is prepared for thermal compression bonding by first aligning electrical contacts on the die to bond pads on a substrate onto which the die is to be mounted. Those electrical contacts are held against the bond pads on the substrate with a bonding tool. Partially bonding the die onto the substrate by providing heat to a portion of the die to elevate a temperature there to above a melting point of solder in the electrical contacts so as to melt at least some of the solder. Then thermally compress the whole die and heat it to above the melting point of the solder of the electrical contacts so that the solder of the electrical contacts outside the portion of the die are also melted to bond the die to the substrate.