Ka San Lam

Title: The Innovative Contributions of Ka San Lam

Introduction

Ka San Lam is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to the development of a unique patent that enhances the efficiency of semiconductor chip bonding.

Latest Patents

Ka San Lam holds a patent for "Thermal compression bonding of semiconductor chips." This invention involves a meticulous process where a die is prepared for thermal compression bonding by aligning electrical contacts on the die to bond pads on a substrate. The electrical contacts are held against the bond pads using a bonding tool. The process includes partially bonding the die onto the substrate by applying heat to elevate the temperature above the melting point of solder in the electrical contacts. This allows for the melting of some solder, followed by thermal compression of the entire die to ensure a robust bond with the substrate.

Career Highlights

Ka San Lam is currently employed at Asm Technology Singapore Pte Ltd, where he continues to innovate in the semiconductor industry. His work has been instrumental in advancing the technology used in semiconductor manufacturing. With a focus on improving bonding techniques, he has contributed to the efficiency and reliability of semiconductor devices.

Collaborations

Ka San Lam collaborates with talented professionals in his field, including Yiu Ming Cheung and Tsan Yin Peter Lo. These collaborations foster an environment of innovation and creativity, leading to groundbreaking advancements in semiconductor technology.

Conclusion

Ka San Lam's contributions to the field of semiconductor technology through his patent and career at Asm Technology Singapore Pte Ltd highlight his role as a key innovator. His work not only enhances the efficiency of semiconductor bonding but also sets a foundation for future advancements in the industry.