Company Filing History:
Years Active: 2015
Title: Tsan Yin Peter Lo: Innovator in Semiconductor Technology
Introduction
Tsan Yin Peter Lo is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to thermal compression bonding of semiconductor chips. His work has implications for the efficiency and reliability of electronic devices.
Latest Patents
Tsan Yin Peter Lo holds a patent for the thermal compression bonding of semiconductor chips. This patent describes a method where a die is prepared for bonding by aligning electrical contacts on the die with bond pads on a substrate. The process involves partially bonding the die by applying heat to elevate the temperature above the melting point of solder in the electrical contacts. This allows for the solder to melt and bond the die to the substrate effectively.
Career Highlights
Tsan Yin Peter Lo is currently employed at Asm Technology Singapore Pte Ltd, where he continues to advance his research and development in semiconductor technologies. His expertise in thermal compression bonding has positioned him as a key player in the industry.
Collaborations
Tsan has collaborated with several professionals in his field, including Yiu Ming Cheung and Ming Li, who contribute to the innovative environment at Asm Technology Singapore Pte Ltd.
Conclusion
Tsan Yin Peter Lo's contributions to semiconductor technology through his patent on thermal compression bonding demonstrate his commitment to innovation in the field. His work continues to influence the development of more efficient electronic devices.