Yick Hong Mak

Title: Yick Hong Mak: Innovator in Semiconductor Technology

Introduction

Yick Hong Mak is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to thermal compression bonding of semiconductor chips. His work has implications for the efficiency and reliability of electronic devices.

Latest Patents

Yick Hong Mak holds a patent for the thermal compression bonding of semiconductor chips. This patent describes a method where a die is prepared for bonding by aligning electrical contacts on the die with bond pads on a substrate. The process involves holding the electrical contacts against the bond pads using a bonding tool. The die is partially bonded by applying heat to elevate the temperature above the melting point of solder in the electrical contacts, allowing some solder to melt. The entire die is then thermally compressed and heated to ensure that all solder bonds effectively to the substrate.

Career Highlights

Yick Hong Mak is currently employed at Asm Technology Singapore Pte Ltd, where he continues to advance his research and development in semiconductor technologies. His expertise in thermal compression bonding has positioned him as a key player in the industry.

Collaborations

Yick collaborates with talented professionals in his field, including Yiu Ming Cheung and Tsan Yin Peter Lo. Their combined efforts contribute to the innovative projects at Asm Technology Singapore Pte Ltd.

Conclusion

Yick Hong Mak's contributions to semiconductor technology through his patent on thermal compression bonding demonstrate his commitment to innovation in the field. His work not only enhances the performance of electronic devices but also showcases the importance of collaboration in technological advancements.