The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 27, 2011
Filed:
Jul. 28, 2003
Yiu Ming Cheung, Hong Kong, CN;
Chi Ming Chong, Hong Kong, CN;
Tat Wing Lee, Hong Kong, CN;
Ka Lok Leung, Hong Kong, CN;
Yiu Ming Cheung, Hong Kong, CN;
Chi Ming Chong, Hong Kong, CN;
Tat Wing Lee, Hong Kong, CN;
Ka Lok Leung, Hong Kong, CN;
ASM Assembly Automation Ltd, Hong Kong, HK;
Abstract
The invention provides an apparatus and method for thin die detachment involving the use of a collet for holding and detaching a die mounted on an adhesive surface of an adhesive film. An ejector device comprising a plurality of ejector pins is employed to partially delaminate said die from the adhesive surface for detachment by the collet. Each ejector pin is operative to contact and raise a second surface of the film opposite the adhesive surface at a position substantially at a corner of the die to be detached within a predetermined distance from the edges of said die.