The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2007
Filed:
May. 11, 2004
Yiu Ming Cheung, Mei Foo Sun Chuen, HK;
Chou Kee Liu, Kowloon, HK;
Ching Hong Yiu, Kowloon, HK;
Chi Ming Chong, Carado Garden, HK;
Yiu Ming Cheung, Mei Foo Sun Chuen, HK;
Chou Kee Liu, Kowloon, HK;
Ching Hong Yiu, Kowloon, HK;
Chi Ming Chong, Carado Garden, HK;
ASM Assembly Automation Ltd., Hong Kong, HK;
Abstract
An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive tape in a direction away from the chip. An elevation device is projectable from the platform that is movable both laterally across a surface of the platform and vertically with respect to the platform for elevating the chip. By moving the elevation device across a width of the chip while lifting the chip, controlled lifting of the chip and propagation of delamination between the chip and the adhesive tape may be achieved.