Chou Kee Liu

Title: Chou Kee Liu: Innovator in Semiconductor Technology

Introduction

Chou Kee Liu is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative spirit and technical expertise.

Latest Patents

One of his latest patents is an "Apparatus for Semiconductor Chip Detachment." This invention provides a method for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus includes a platform that contacts the adhesive tape at the chip's position and a retaining force generator that draws the adhesive tape away from the chip. An elevation device is also included, which can move laterally and vertically to elevate the chip, allowing for controlled lifting and delamination between the chip and the adhesive tape.

Another significant patent is the "High Speed Pick and Place Apparatus." This apparatus features a bond arm that rotates between a pick location and a place location. The bond arm contains a cavity filled with damping particles, which help to reduce unwanted vibrations during operation. The particles are irregular tungsten granules, with a specific diameter and filling ratio, ensuring optimal performance.

Career Highlights

Chou Kee Liu is currently employed at Asm Assembly Automation Limited, where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Chou has collaborated with talented individuals such as Ping Kong Choy and Wei Hsin Laio, who contribute to the innovative environment at Asm Assembly Automation Limited.

Conclusion

Chou Kee Liu's contributions to semiconductor technology through his patents and collaborative efforts highlight his role as a key innovator in the field. His inventions not only enhance manufacturing processes but also pave the way for future advancements in technology.