The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2004
Filed:
Jul. 10, 2001
Applicant:
Inventors:
Ping Kong Choy, Kwai Chung, HK;
Chou Kee Liu, Kwai Chung, HK;
Wei Hsin Laio, Kwai Chung, HK;
Yu Wang, Kwai Chung, HK;
Assignee:
ASM Assembly Automation Limited, Kwai Chung, HK;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B25J 1/100 ;
U.S. Cl.
CPC ...
B25J 1/100 ;
Abstract
A pick and place apparatus comprises a bond arm adapted for rotation about an axis between a pick location and a place location. The bond arm is formed with a cavity at an end of the arm remote from the axis, within which cavity are located a plurality of damping particles for damping unwanted vibrations of the bond arm. The particles may be irregular tungsten granules with a diameter between 0.3 and 1.2 mm and a filling ratio of about 75%.