The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 23, 2010

Filed:

Oct. 16, 2006
Applicants:

Yiu Ming Cheung, Hong Kong, CN;

Shiqiang Yao, Hong Kong, CN;

Gary Peter Widdowson, Hong Kong, CN;

Inventors:

Yiu Ming Cheung, Hong Kong, CN;

Shiqiang Yao, Hong Kong, CN;

Gary Peter Widdowson, Hong Kong, CN;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23P 19/00 (2006.01); B29C 1/00 (2006.01); B29C 63/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An apparatus and method are provided for detaching a die from an adhesive film, the apparatus comprising a vacuum platform having a surface configured to support a part of the adhesive film on which the die is attached. A plurality of pre-peeling columns having substantially flat contact surfaces are projectable relative to the surface of the vacuum platform to push against the adhesive film at the position of the die to generate initial peeling between the die and the adhesive film. Thereafter, a plurality of ejector pins that are positionable relative to the pre-peeling columns are operative to push against the adhesive film at the position of the die to generate further peeling between the die and the adhesive film. The die is then removed from the adhesive film.


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