The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 2013
Filed:
Oct. 14, 2010
Chi Ming Chong, Kwai Chung, HK;
Jin Hui Meng, Kwai Chung, HK;
Man Wai Chan, Kwai Chung, HK;
Yuk Cheung AU, Kwai Chung, HK;
Chi Ming Chong, Kwai Chung, HK;
Jin Hui Meng, Kwai Chung, HK;
Man Wai Chan, Kwai Chung, HK;
Yuk Cheung Au, Kwai Chung, HK;
ASM Assembly Automation Ltd, Hong Kong, HK;
Abstract
A die detachment apparatus for partially delaminating a die from an adhesive tape on which it is mounted comprises a cover having a support surface that is operative to support the adhesive tape, the support surface including a set of cover holes. A movable pin chuck is positioned below the support surface and includes a set of pin holes that are arranged coaxially with the cover holes. The movable pin chuck is configured for detachably inserting a set of pins in a first desired configuration on some of the pin holes, and the pins are also operable to be relocated on the pin chuck to form another desired configuration. The pins are operative to protrude from the cover by passing through the cover holes to contact and lift the die.