Company Filing History:
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1 out of 234 
Years Active: 2013-2018
Title: Jin Hui Meng: Innovator in Die Bonding Technology
Introduction
Jin Hui Meng is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of die bonding technology, holding a total of 2 patents. His innovative designs have the potential to enhance manufacturing processes in various industries.
Latest Patents
Jin Hui Meng's latest patents include a die bonding tool and system. The die bonding tool features a rigid body and a collet with a die-holding portion. The collet is mechanically coupled to the rigid body by a flexible element, allowing for angular deflection when torque is applied. Additionally, the die bonding system incorporates an adhesive dispenser, streamlining the die bonding process. Another patent is the universal die detachment apparatus, which is designed for partially delaminating a die from an adhesive tape. This apparatus includes a cover with a support surface and a movable pin chuck that can detachably insert pins to lift the die.
Career Highlights
Throughout his career, Jin Hui Meng has worked with reputable companies such as ASM Assembly Automation Limited and ASM Technology Singapore Pte Ltd. His experience in these organizations has contributed to his expertise in die bonding technologies.
Collaborations
Jin Hui Meng has collaborated with professionals like Chi Ming Chong and Man Wai Chan. These partnerships have likely fostered innovation and development in his projects.
Conclusion
Jin Hui Meng is a distinguished inventor whose work in die bonding technology has led to valuable patents. His contributions continue to influence the industry and pave the way for future advancements.