The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 05, 2013
Filed:
May. 04, 2012
Chung Sheung Yung, Hong Kong, CN;
Shing Lui Lau, Hong Kong, CN;
Chi Ming Chong, Hong Kong, CN;
Gary Peter Widdowson, Hong Kong, CN;
Chung Sheung Yung, Hong Kong, CN;
Shing Lui Lau, Hong Kong, CN;
Chi Ming Chong, Hong Kong, CN;
Gary Peter Widdowson, Hong Kong, CN;
ASM Technology Singapore Pte. Ltd., Singapore, SG;
Abstract
An apparatus for aligning a bonding tool of a die bonder with respect to a bond stage is disclosed. The apparatus comprises: a connecting member to which the bonding tool is coupleable such that the connecting member is located between the bonding tool and a main body of a die bonder; and a plurality of actuators engaged to the connecting member. In particular, the plurality of actuators are actuable to rotate the connecting member and the bonding tool relative to the main body of the die bonder about a plurality of axes, to align the bonding tool with respect to the bond stage.