Company Filing History:
Years Active: 2013
Title: Shing Lui Lau - Innovator in Die Bonding Technology
Introduction
Shing Lui Lau is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of die bonding technology, particularly with his innovative apparatus designed for aligning bonding tools.
Latest Patents
Shing Lui Lau holds 1 patent for his invention titled "Apparatus for aligning a bonding tool of a die bonder." This apparatus is designed to enhance the precision of die bonding processes. It comprises a connecting member that couples the bonding tool, allowing for adjustments in alignment with respect to the bond stage. The apparatus features a plurality of actuators that enable rotation of the connecting member and bonding tool relative to the die bonder's main body, facilitating accurate alignment.
Career Highlights
Shing Lui Lau is currently employed at Asm Technology Singapore Pte Ltd, where he continues to develop and refine technologies in the semiconductor industry. His work has been instrumental in improving the efficiency and accuracy of die bonding operations.
Collaborations
Shing has collaborated with talented coworkers, including Chung Sheung Yung and Chi Ming Chong, contributing to advancements in their shared field of expertise.
Conclusion
Shing Lui Lau's innovative work in die bonding technology exemplifies the impact of dedicated inventors in the semiconductor industry. His contributions continue to influence the efficiency of manufacturing processes.