The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 19, 2016
Filed:
Dec. 22, 2014
Applicants:
Mei Po Leung, Kwai Chung, HK;
Wing Yin Lee, Kwai Chung, HK;
Chi Ming Chong, Kwai Chung, HK;
Inventors:
Assignee:
ASM TECHNOLOGY SINGAPORE PTE LTD, Singapore, SG;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 37/00 (2006.01); H01L 21/67 (2006.01); B23K 3/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67144 (2013.01); B23K 3/028 (2013.01); B23K 3/029 (2013.01); H01L 21/6704 (2013.01);
Abstract
A die bonder comprises a movable bond collet for holding an electronic device, and a platform which comprises a cleaning surface for cleaning the bond collet when the bond collet contacts the cleaning surface. The die bonder also comprises a cleaning agent supply, wherein the cleaning agent supply is operative to provide a cleaning agent to the cleaning surface to facilitate the cleaning of the bond collet.