The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 10, 2012
Filed:
Feb. 05, 2010
Siu Ping Yip, Kwai Chung, HK;
Chi Ming Chong, Kwai Chung, HK;
Man Wai Chan, Kwai Chung, HK;
Kwok Wai Wong, Kwai Chung, HK;
Siu Ping Yip, Kwai Chung, HK;
Chi Ming Chong, Kwai Chung, HK;
Man Wai Chan, Kwai Chung, HK;
Kwok Wai Wong, Kwai Chung, HK;
ASM Assembly Automation Ltd, Hong Kong, HK;
Abstract
During detachment of a die from an adhesive tape, the inner and outer portions of a first side of the die which is in contact with the adhesive tape is supported with a support surface. A collet contacts the inner and outer portions of a second side of the die opposite to the first side. Support is withdrawn from the outer portion of the die such that the outer portion of the second side of the die bends away from the collet while the support surface only supports the inner portion of the die. Vacuum suction from the collet is applied to attract the outer portion of the die towards the collet and the vacuum suction pressure is monitored until a threshold pressure is reached indicating that the outer portion of the die is contacting the collet. Thereafter, the collet is lifted while holding the die with vacuum suction to completely separate the die from the adhesive tape.