This inventor holds 1 USPTO granted patent. Top assignee: Asm Assembly Automation Limited. Active years: 2012.
Company Filing History:
Years Active: 2012
Title: Siu Ping Yip: Innovator in Die Detachment Technology
Introduction
Siu Ping Yip is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of automation and technology, particularly in the area of die detachment systems. His innovative approach has led to the development of a unique patent that addresses challenges in the manufacturing process.
Latest Patents
Siu Ping Yip holds a patent for a "Control and monitoring system for thin die detachment and pick-up." This invention provides a method for detaching a die from an adhesive tape while ensuring that the die is supported adequately during the process. The system involves a collet that contacts the die and utilizes vacuum suction to facilitate the detachment, monitoring the pressure to ensure successful separation.
Career Highlights
Siu Ping Yip is currently employed at Asm Assembly Automation Limited, where he applies his expertise in automation technologies. His work focuses on enhancing manufacturing processes through innovative solutions. With a patent portfolio that includes 1 patent, he has established himself as a key figure in his field.
Collaborations
Siu Ping Yip collaborates with talented colleagues such as Chi Ming Chong and Man Wai Chan. Together, they work on advancing technologies that improve efficiency and effectiveness in manufacturing.
Conclusion
Siu Ping Yip's contributions to the field of die detachment technology exemplify his innovative spirit and dedication to improving manufacturing processes. His patent reflects a significant advancement in automation, showcasing his role as a leading inventor in Hong Kong.