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For the Inventor, By the Inventor

Kaohsiung, Taiwan

Chi-Chih Shen

USPTO Granted Patents = 14 

Average Co-Inventor Count = 3.6

ph-index = 7

Forward Citations = 351(Granted Patents)


Location History:

  • Kaohsiung City, TW (2010)
  • Kaohsiung, TW (2002 - 2022)

Company Filing History:

goldMedal12 out of 1,870 
 
Advanced Semiconductor Engineering, Inc.
 patents
silverMedal2 out of 832,718 
Other
 patents

Years Active: 2002-2025

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14 patents (USPTO):Explore Patents
1. 12266632 - Package process and package structure (2025-04-01),
2. 11222866 - Package process and package structure (2022-01-11),
3. 9698120 - Package process and package structure (2017-07-04),
4. 8618645 - Package process and package structure (2013-12-31),
5. 8446000 - Package structure and package process (2013-05-21),
6. 8390129 - Semiconductor device with a plurality of mark through substrate vias (2013-03-05),
7. 8258007 - Package process (2012-09-04),
8. 8158888 - Circuit substrate and method of fabricating the same and chip package structure (2012-04-17),
9. 8110928 - Stacked-type chip package structure and method of fabricating the same (2012-02-07),
10. 8105877 - Method of fabricating a stacked type chip package structure (2012-01-31),
11. 8076765 - Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors (2011-12-13),
12. 8012797 - Method for forming stackable semiconductor device packages including openings with conductive bumps of specified geometries (2011-09-06),
13. 7791211 - Flip chip package structure and carrier thereof (2010-09-07),
14. 6383846 - Method and apparatus for molding a flip chip semiconductor device (2002-05-07),

Title: Chi-Chih Shen: Innovator in Semiconductor Packaging

Introduction

Chi-Chih Shen is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 14 patents. His innovative designs and processes have advanced the technology used in electronic devices.

Latest Patents

One of Chi-Chih Shen's latest patents focuses on a package process and package structure. This package structure includes several key components: a circuit substrate, a first semiconductor device disposed on the circuit substrate, a first insulation layer covering a sidewall of the first semiconductor device, a second insulation layer covering the first insulation layer, and a third insulation layer disposed on the circuit substrate and in contact with the second insulation layer. This innovative design enhances the reliability and performance of semiconductor devices.

Career Highlights

Throughout his career, Chi-Chih Shen has worked with notable companies, including Advanced Semiconductor Engineering, Inc. His experience in the semiconductor industry has allowed him to develop cutting-edge technologies that are widely used today.

Collaborations

Chi-Chih Shen has collaborated with talented individuals in his field, including Jen-Chuan Chen and Hui-Shan Chang. These collaborations have contributed to the success of his projects and the advancement of semiconductor packaging technology.

Conclusion

Chi-Chih Shen is a distinguished inventor whose work in semiconductor packaging has led to numerous patents and innovations. His contributions continue to shape the future of electronic devices and enhance their performance.

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