The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 21, 2013
Filed:
May. 24, 2010
Chi-chih Shen, Kaohsiung, TW;
Jen-chuan Chen, Taoyuan County, TW;
Tommy Pan, Taipei, TW;
Hui-shan Chang, Taoyuan County, TW;
Chia-lin Hung, Taoyuan County, TW;
Chi-Chih Shen, Kaohsiung, TW;
Jen-Chuan Chen, Taoyuan County, TW;
Tommy Pan, Taipei, TW;
Hui-Shan Chang, Taoyuan County, TW;
Chia-Lin Hung, Taoyuan County, TW;
Other;
Abstract
A package process includes following steps. A circuit mother board comprising a plurality of circuit boards is disposed on a carrier. Semiconductor devices are provided, wherein each of the semiconductor devices has a top surface and a bottom surface opposite thereto. Each of the semiconductor devices has conductive vias each having a first end surface and a second end surface exposed by the bottom surface of the semiconductor device. The semiconductor devices are connected to the corresponding circuit boards through their conductive vias with their bottom surface facing the circuit mother board. An insulating paste is formed between each of the semiconductor devices and its corresponding circuit board. A protection layer is formed on the circuit mother board to cover the semiconductor devices. Then, the protection layer and the semiconductor devices are thinned to expose the first end surface of each of the conductive vias.