Chia-Lin Hung

Title: Chia-Lin Hung: Innovator in Semiconductor Packaging

Introduction

Chia-Lin Hung is a prominent inventor based in Zhongli, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His innovative approaches have advanced the efficiency and effectiveness of semiconductor manufacturing processes.

Latest Patents

Chia-Lin Hung's latest patents include a "Semiconductor package with through silicon vias and method for making the same." This invention relates to a stacked semiconductor package and outlines a method that involves mounting multiple first dice to a wafer through a reflow process. The wafer is then thinned from the backside surface, which reduces manufacturing time and prevents warpage. Another notable patent is the "Package structure and package process." This process details the steps involved in connecting semiconductor devices to circuit boards, ensuring that each device's conductive vias are properly aligned and insulated.

Career Highlights

Throughout his career, Chia-Lin Hung has worked with various companies, including Advanced Semiconductor Engineering, Inc. His work has been instrumental in developing advanced semiconductor technologies that are crucial for modern electronics.

Collaborations

Chia-Lin Hung has collaborated with notable colleagues such as Jen-Chuan Chen and Hui-Shan Chang. Their combined expertise has contributed to the successful development of innovative semiconductor solutions.

Conclusion

Chia-Lin Hung's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in the field. His patents reflect a deep understanding of the complexities involved in semiconductor manufacturing, paving the way for future advancements.