The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 04, 2014
Filed:
Dec. 05, 2011
Applicants:
Chia-lin Hung, Zhongli, TW;
Jen-chuan Chen, Bade, TW;
Hui-shan Chang, Jhongli, TW;
Kuo-pin Yang, Kaohsiung, TW;
Inventors:
Chia-Lin Hung, Zhongli, TW;
Jen-Chuan Chen, Bade, TW;
Hui-Shan Chang, Jhongli, TW;
Kuo-Pin Yang, Kaohsiung, TW;
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract
The present invention relates to a stacked semiconductor package and a method for making the same. The method includes the steps of mounting a plurality of first dice to a wafer by conducting a reflow process; and thinning the wafer from the backside surface of the wafer, thereby reducing manufacturing time and preventing warpage.