The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2011
Filed:
Jul. 22, 2009
Kuang-hsiung Chen, Taoyuan County, TW;
Chi-chih Shen, Kaohsiung, TW;
Jen-chuan Chen, Taoyuan County, TW;
Wen-hsiung Chang, Hsinchu, TW;
Hui-shan Chang, Jhongli, TW;
Pei-yu Hsu, Hsin-Pu Township, Hsinchu County, TW;
Fa-hao Wu, Pingjhen, TW;
Chen-yu Chia, Gueishan Township, Taoyuan County, TW;
Chi-chih Chu, Kaohsiung, TW;
Cheng-yi Weng, Kaohsiung, TW;
Ya-wen Hsu, Tainan, TW;
Kuang-Hsiung Chen, Taoyuan County, TW;
Chi-Chih Shen, Kaohsiung, TW;
Jen-Chuan Chen, Taoyuan County, TW;
Wen-Hsiung Chang, Hsinchu, TW;
Hui-Shan Chang, Jhongli, TW;
Pei-Yu Hsu, Hsin-Pu Township, Hsinchu County, TW;
Fa-Hao Wu, Pingjhen, TW;
Chen-Yu Chia, Gueishan Township, Taoyuan County, TW;
Chi-Chih Chu, Kaohsiung, TW;
Cheng-Yi Weng, Kaohsiung, TW;
Ya-Wen Hsu, Tainan, TW;
Advanced Semiconductor Engineering, Inc., Kaosiung, TW;
Abstract
In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width W, and at least one of the openings has a width Wadjacent to an upper surface of the package body, such that W>W.