Company Filing History:
Years Active: 2011-2015
Title: The Innovative Contributions of Fa-Hao Wu
Introduction
Fa-Hao Wu is a prominent inventor based in Pingjhen, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 2 patents. His work focuses on enhancing the functionality and efficiency of semiconductor device packages.
Latest Patents
Wu's latest patents include innovative designs for semiconductor device packages. One of his notable inventions is a semiconductor device package that features a side-by-side device arrangement and stacking functionality. This package includes a substrate, a first device module, a second device module, and a package body. The first and second device modules are arranged side-by-side on the substrate's carrier surface, with distinct connecting elements that differ in pitch. The package body covers both modules while exposing the connecting elements through specific openings.
Another significant patent involves stackable semiconductor device packages that include openings partially exposing connecting elements, conductive bumps, or conductive conductors. This design comprises a substrate unit, connecting elements extending from the substrate's upper surface, and a semiconductor device electrically connected to the substrate. The package body aligns with the substrate's lateral surface and defines openings that expose the connecting elements, enhancing the device's overall functionality.
Career Highlights
Fa-Hao Wu is associated with Advanced Semiconductor Engineering, Inc., a leading company in the semiconductor industry. His work has contributed to advancements in semiconductor packaging technology, which is crucial for the performance of electronic devices.
Collaborations
Wu has collaborated with notable colleagues, including Kuang-Hsiung Chen and Chi-Chih Shen. These partnerships have fostered innovation and development in their respective projects.
Conclusion
Fa-Hao Wu's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the field. His innovative designs continue to shape the future of semiconductor device packaging.