Advanced Semiconductor Engineering, Inc.

Fa-Hao Wu

Kuang-Hsiung Chen

Chi-Tsung Chiu

Chi-Chih Shen

Jen-Chuan Chen

Wen-Hsiung Chang

Chi-Chih Chu

Hui-Shan Chang

Cheng-Yi Weng

Pei-Yu Hsu

Yu-Ching Sun

Chen-Yu Chia

Ya-Wen Hsu

A semiconductor device package including a substrate, a first device module, a second device module, and an package body. The first device module and the second device module are disposed side-by-side on a carrier surface of the substrate. The first device module includes first connecting elements provided with a first pitch. The second device module includes second connecting elements provided with a second pitch. The first pitch is different from the second pitch. The package body is disposed on the carrier surface and covers the first chip module and the second chip module. The package body includes first openings exposing the first connecting elements and second openings exposing the second connecting elements.

Semiconductor device packages having a side-by-side device arrangement and stacking functionality

In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width W, and at least one of the openings has a width Wadjacent to an upper surface of the package body, such that W&#x3e;W.

Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductors

Growing community of inventors

Pingjhen, Taiwan

Fa-Hao Wu