The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 27, 2015
Filed:
Feb. 28, 2011
Yu-ching Sun, Jhongli, TW;
Fa-hao Wu, Pingjhen, TW;
Kuang-hsiung Chen, Taoyuan, TW;
Chi-tsung Chiu, Kaohsiung, TW;
Yu-Ching Sun, Jhongli, TW;
Fa-Hao Wu, Pingjhen, TW;
Kuang-Hsiung Chen, Taoyuan, TW;
Chi-Tsung Chiu, Kaohsiung, TW;
ADVANCED SEMICONDUCTOR ENGINEERING, INC., Kaohsiung, TW;
Abstract
A semiconductor device package including a substrate, a first device module, a second device module, and an package body. The first device module and the second device module are disposed side-by-side on a carrier surface of the substrate. The first device module includes first connecting elements provided with a first pitch. The second device module includes second connecting elements provided with a second pitch. The first pitch is different from the second pitch. The package body is disposed on the carrier surface and covers the first chip module and the second chip module. The package body includes first openings exposing the first connecting elements and second openings exposing the second connecting elements.